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SCHAEFER HANS JUERGEN

Overview
  • Total Patents
    21
  • GoodIP Patent Rank
    229,743
About

SCHAEFER HANS JUERGEN has a total of 21 patent applications. Its first patent ever was published in 1990. It filed its patents most often in Germany, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets audio-visual technology, surface technology and coating and optics are KLINGEL WOLFGANG, LEEB KARL ERIK and SHENZHEN KINWONG ELECTRONIC CO LTD.

Patent filings in countries

World map showing SCHAEFER HANS JUERGENs patent filings in countries

Patent filings per year

Chart showing SCHAEFER HANS JUERGENs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Schaefer Hans-Juergen Dipl Ing 10
#2 Schaefer Hans-Juergen 8
#3 Schaefer Hans-Juergen Dipl-Ing 2
#4 Schäfer Hans-Jürgen 1

Latest patents

Publication Filing date Title
DE102018007718A1 Campsleeper a city u. Travel van or a caravan with beds arranged vertically at the stern and / or bow, which are folded horizontally and covered with attached sleeping cabins or cube or semi-dome tents stabilized with pressure pillar columns
DE10100002A1 Sequential pressing method for production of high pressure multilayer laminates for printed circuits uses a single daylight press to which the laminate is conveyed by metal foils
DE10042122A1 Process for forming high copper adhesive strength on dielectric layers structured by a laser comprises applying a dielectric layer on a circuit board, bringing to a specified viscosity, and irradiating the dielectric layer with particles
WO0042830A1 Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boards
DE19939740A1 Roller coating system for applying variable thickness layer of thermal and IR/UV radiation hardenable material on printed circuit boards of different widths, using pair of rollers arranged such that sticking of rollers is prevented
DE19931692A1 Method and device for producing dielectric-coated copper foil, which is laminated on printed circuit boards
DE19923117A1 Filling bores in HDI multilayers, involves heating epoxy resin lacquer, moving to column setting device, sucking into bores, removing excess, and setting lacquer in bores with ultraviolet light
DE19812471A1 Method and device for the two-layer coating of copper foils with meltable coating agents
DE19802272A1 Two-layer coating equipment producing circuit boards
DE19741802A1 Arrangement for selective coating of circuit boards on both sides with high viscosity material
DE19704260A1 Selectively lacquer coating circuit boards
DE19650310A1 Dimensionally stable, untwisted, non-curved epoxide glass laminate production
DE19539193A1 Making epoxy] resin coated films for via sheets for multi layer switches for IC s
EP0766908A1 Method and device for coating printed-circuit boards, in particular for the manufacture of multi-chip-modules
DE19516193A1 Coating circuit boards
DE19510227A1 Application of UV-curable coating compsn. to both sides of circuit board
DE19509111A1 Ecological-solar house being industrially produced
DE4325661A1 Method and device for flattening remelted solder deposits
DE4200149A1 Circuit board varnishing - using poured curtain of degassed varnish on cooled circuit boards for controlled temp. varnish flow without bubbles
EP0456883A1 Process and apparatus for coating and continuous lamination