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SAMSUNG SEMICONDUCTOR CHINA RES & DEV CO LTD

Overview
  • Total Patents
    31
About

SAMSUNG SEMICONDUCTOR CHINA RES & DEV CO LTD has a total of 31 patent applications. Its first patent ever was published in 2010. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, basic communication technologies and control are NANJING HUARUI MICROCHIP CO LTD, ORGANICID INC and SHIN DONG-SUK.

Patent filings in countries

World map showing SAMSUNG SEMICONDUCTOR CHINA RES & DEV CO LTDs patent filings in countries
# Country Total Patents
#1 China 31

Patent filings per year

Chart showing SAMSUNG SEMICONDUCTOR CHINA RES & DEV CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Maohua Du 5
#2 Xu Lei 4
#3 Huishu Ma 4
#4 Song Chen 3
#5 Wang Yuchuan 2
#6 Chunyan Ruan 2
#7 Peng Shen 1
#8 Weicong Hu 1
#9 Like Yan 1
#10 Fang Maochun 1

Latest patents

Publication Filing date Title
CN103762200A Chip packaging part and packaging method of chip packaging part
CN103763857A Chip on board printed circuit board
CN103744477A Separating type double screen terminal and control system thereof
CN103730438A Chip package and method for manufacturing chip package
CN103731547A Display method for mobile communication terminal
CN103729007A Linear regulator with soft start control circuit
CN103593036A System-on-a-chip dynamically adjusting voltage/clock frequency
CN103579171A Semiconductor packaging piece and manufacturing method thereof
CN103499273A Method for measuring warpage of electronic packaging component and electronic packaging component
CN103491230A Mobile terminal capable of automatically adjusting volume and fonts and automatic adjusting method thereof
CN103491229A Method and equipment for managing phone numbers of contact people
CN103489793A Method for forming solder ball on bonding pad of substrate
CN102412241A Semiconductor chip encapsulating piece and manufacturing method thereof
CN102376655A Chip packaging structure with metal layer
CN102368472A Ball placement equipment and ball placement method
CN102386165A Chip package and manufacturing method thereof
CN102315192A Semiconductor packaging part
CN102332436A Package of shape memory alloy core structure
CN102332617A Portable terminal and method for identifying battery of portable terminal
CN102254891A Flip chip packaging structure and manufacturing method thereof