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ROHCO INC MCGEAN

Overview
  • Total Patents
    91
About

ROHCO INC MCGEAN has a total of 91 patent applications. Its first patent ever was published in 1981. It filed its patents most often in United States, EPO (European Patent Office) and Japan. Its main competitors in its focus markets surface technology and coating, audio-visual technology and machines are LEARONAL JAPAN INC, GA TEK INC and YATES FOIL USA INC.

Patent filings in countries

World map showing ROHCO INC MCGEANs patent filings in countries

Patent filings per year

Chart showing ROHCO INC MCGEANs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Bokisa George S 15
#2 Bishop Craig V 15
#3 Vitale Americus C 11
#4 Dodd John R 10
#5 Willis William J 8
#6 Canaris Valerie M 7
#7 Opaskar Vincent C 6
#8 King Randal D 6
#9 Frisby C Richard 5
#10 King Randal Daniel 5

Latest patents

Publication Filing date Title
US6086779A Copper etching compositions and method for etching copper
US6063172A Aqueous immersion plating bath and method for plating
SG73541A1 Paint stripper compositions
US5928790A Multilayer circuit boards and processes of making the same
US5554211A Aqueous electroless plating solutions
US5597975A Mechanical plating of small arms projectiles
US5696072A Pseudoplastic, shear thinned paint stripper
IL111497D0 Silane compositions useful as adhesives
US5411678A Paint stripper
US5417840A Alkaline zinc-nickel alloy plating baths
US5393354A Iridescent chromium coatings and method
US5393353A Chromium-free black zinc-nickel alloy surfaces
US5415702A Black chromium-containing conversion coatings on zinc-nickel and zinc-iron alloys
US5411595A Post-etch, printed circuit board cleaning process
CA2193007A1 Process for extending the life of a displacement plating bath
CA2083196A1 Process for extending the life of a displacement plating bath
US5698087A Plating bath and method for electroplating tin and/or lead
US5151170A Acid copper electroplating bath containing brightening additive
US5221328A Method of controlling orthophosphite ion concentration in hyphophosphite-based electroless plating baths
US5196053A Complexing agent for displacement tin plating