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LEARONAL JAPAN INC

Overview
  • Total Patents
    42
About

LEARONAL JAPAN INC has a total of 42 patent applications. Its first patent ever was published in 1992. It filed its patents most often in Japan, WIPO (World Intellectual Property Organization) and Australia. Its main competitors in its focus markets surface technology and coating, audio-visual technology and machines are ROHCO INC MCGEAN, NIPPON DENKAI LTD and RICHARDSON CHEMICAL CO.

Patent filings per year

Chart showing LEARONAL JAPAN INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tsuchida Hideki 23
#2 Seita Masaru 12
#3 Imanari Masaaki 11
#4 Kiyota Masaru 10
#5 Kusaka Masaru 10
#6 Suda Kazuyuki 7
#7 Nawafune Hidemi 6
#8 Hayashi Shinjiro 6
#9 Yomogida Koichi 6
#10 Sugita Yoshihiro 5

Latest patents

Publication Filing date Title
JP2004176148A Electrolytic copper plating method
JP2003213478A Electrolytic copper plating method
JP2003055800A Electrolytic copper plating method
JP2003213489A Method of via-filling
JP2003193284A Nickel electroplating solution
JP2003193285A Nickel electroplating solution
TWI255871B Electrolytic copper plating solution and process for electrolytic plating using the same
JP2003183885A Via filling method
JP2003183879A Electrolytic plating method
JP2002249891A Electrolytic copper plating solution and method for controlling the same
JP2003147540A Method for measuring concentration of sulfur-containing compound in electroless nickel plating solution
JP2003145674A Method for forming resin composite material
WO0231228A1 Copper electroplating using insoluble anode
TW584674B A tin electroplating solution and its process
JP2003064480A Method for forming copper-resin composite material
JP2003041400A Apparatus and method for manufacturing printed wiring board
JP2003013248A Electroless gold plating solution and method for electroless plating gold
JP2002348673A Electroless copper plating method without using formaldehyde, and electroless copper plating solution therefor
JP2002241950A Direct patterning method
JP2002192648A Composite material improved in junction strength and method for forming the same