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CO TECH DEV CORP

Overview
  • Total Patents
    21
  • GoodIP Patent Rank
    80,022
  • Filing trend
    ⇧ 200.0%
About

CO TECH DEV CORP has a total of 21 patent applications. It increased the IP activity by 200.0%. Its first patent ever was published in 2014. It filed its patents most often in Taiwan, United States and Japan. Its main competitors in its focus markets surface technology and coating, audio-visual technology and machines are ROHCO INC MCGEAN, CHANG CHUN PETROCHEMICAL CO LTD and SONG EMC CO LTD E.

Patent filings in countries

World map showing CO TECH DEV CORPs patent filings in countries
# Country Total Patents
#1 Taiwan 8
#2 United States 7
#3 Japan 6

Patent filings per year

Chart showing CO TECH DEV CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Sung Yun-Hsing 14
#2 Kao Chun-Yu 12
#3 Hsu Hung-Wei 10
#4 Lee Shih-Shen 8
#5 Song Yun Xing 4
#6 Gao Qun You 3
#7 Wu Zong-Xian 2
#8 Lee Szu-Hsien 2
#9 Kao Chun Yu 1
#10 Sung Yun Hsing 1

Latest patents

Publication Filing date Title
US2020399776A1 Advanced treated electrodeposited copper foil having long and island-shaped structures and copper clad laminate using the same
JP2021008665A Advanced electrolytic copper foil and copper-clad laminate using the same
TW202100813A Advanced reverse-treated electrodeposited copper foil and copper clad laminate using the same
JP2021001398A Micro-roughened electrodeposited copper foil and copper-clad laminate
TW202046828A Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same
TWI703354B Lens module and its near infrared filter
TW202018096A Micro-roughened electrolytic copper foil and copper clad laminate using the same
TWI669032B Micro-rough electrolytic copper foil and copper foil substrate
TWI668333B Micro-rough electrolytic copper foil and copper foil substrate
TWI627311B Apparatus for production of electrolytic copper foil and current adjusting device thereof
JP2015157741A Manufacturing method of copper oxide and manufacturing facility of copper oxide