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ROGERS GERMANY GMBH

Overview
  • Total Patents
    162
  • GoodIP Patent Rank
    10,782
  • Filing trend
    ⇧ 153.0%
About

ROGERS GERMANY GMBH has a total of 162 patent applications. It increased the IP activity by 153.0%. Its first patent ever was published in 2000. It filed its patents most often in Germany, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, audio-visual technology and materials and metallurgy are CURAMIK ELECTRONICS GMBH, PHYCOMP TAIWAN LTD and ATECT CORP.

Patent filings per year

Chart showing ROGERS GERMANY GMBHs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Meyer Andreas 96
#2 Britting Stefan 62
#3 Schmidt Karsten 41
#4 Gil Vitalij 28
#5 Tang Xinhe 26
#6 Herrmann Rainer 23
#7 Wiesend Johannes 15
#8 Schulz-Harder Jürgen 11
#9 Hierstetter Fabian 10
#10 Reger Martin 10

Latest patents

Publication Filing date Title
DE102019126954A1 Process for the production of a metal-ceramic substrate, soldering system and metal-ceramic substrate produced with such a process
DE102019125124A1 Process for processing a metal-ceramic substrate, system for such a process and metal-ceramic substrates produced with such a process
DE102019118835A1 Method for producing a cooling element and cooling element produced using such a method
DE102019113714A1 Adapter element for connecting an electronic component to a heat sink element, system with such an adapter element and method for producing such an adapter element
DE102019113308A1 A method for producing a metal-ceramic substrate and a metal-ceramic substrate produced by such a method
DE102019110106A1 Method for producing a composite ceramic and composite ceramic produced using such a method
DE102019108594A1 Process for the production of a metal-ceramic substrate and such a metal-ceramic substrate.
DE102018133479A1 Method for manufacturing an electronic module and electronic module
DE102018010352A1 Method for encapsulating at least one carrier substrate, electronic module and tool for encapsulating a carrier substrate
DE102018133420A1 Method for encapsulating at least one carrier substrate, electronic module and tool for encapsulating a carrier substrate
DE102018133456A1 Method for encapsulating at least one carrier substrate, electronic module and tool for encapsulating a carrier substrate
DE102018133434A1 Method for encapsulating at least one carrier substrate
DE102018126802A1 Cooling device for a first electronic module and at least one second electronic module, supply device for such a cooling device and method for cooling a first electronic module and at least one second electronic module
DE102018123681A1 Carrier substrate for electrical, in particular electronic components and method for producing a carrier substrate
DE102018119313A1 Method for processing a metal-ceramic substrate, plant for carrying out the method and metal-ceramic substrate produced by the method
DE102018113571A1 Method for producing a metal-ceramic substrate and metal-ceramic substrate
DE102018112000A1 A system for cooling a metal-ceramic substrate, a metal-ceramic substrate, and method of manufacturing the system
DE102018111989A1 Electronic module and method for producing the same
DE102018104521A1 Metal-ceramic substrate and method for producing a metal-ceramic substrate
DE102018104532A1 Metal-ceramic substrate and method for producing a metal-ceramic substrate