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Method for producing a cooling element and cooling element produced using such a method
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Method for manufacturing an electronic module and electronic module
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Method for encapsulating at least one carrier substrate, electronic module and tool for encapsulating a carrier substrate
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Method for encapsulating at least one carrier substrate, electronic module and tool for encapsulating a carrier substrate
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Method for encapsulating at least one carrier substrate, electronic module and tool for encapsulating a carrier substrate
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Method for encapsulating at least one carrier substrate
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Cooling device for a first electronic module and at least one second electronic module, supply device for such a cooling device and method for cooling a first electronic module and at least one second electronic module
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Carrier substrate for electrical, in particular electronic components and method for producing a carrier substrate
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Method for processing a metal-ceramic substrate, plant for carrying out the method and metal-ceramic substrate produced by the method
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Method for producing a metal-ceramic substrate and metal-ceramic substrate
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A system for cooling a metal-ceramic substrate, a metal-ceramic substrate, and method of manufacturing the system
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Electronic module and method for producing the same
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Metal-ceramic substrate and method for producing a metal-ceramic substrate
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