| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 7 | |
| #2 | United States | 4 | |
| #3 | WIPO (World Intellectual Property Organization) | 4 | |
| #4 | EPO (European Patent Office) | 2 | |
| #5 | Republic of Korea | 2 | |
| #6 | China | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Electrical machinery and energy | |
| #3 | Machines | |
| #4 | Surface technology and coating | |
| #5 | Machine tools | |
| #6 | Materials and metallurgy | |
| #7 | Mechanical elements |
| # | Name | Total Patents |
|---|---|---|
| #1 | Elliot Alfred Grant | 15 |
| #2 | Balma Frank | 13 |
| #3 | Veytser Alexander | 12 |
| #4 | Rex Dennis George | 9 |
| #5 | Elliot Brent Donald Alfred | 8 |
| #6 | Schuster Richard Erich | 8 |
| #7 | Rex Dennis G | 7 |
| #8 | Elliot Brent D A | 7 |
| #9 | Schuster Richard E | 5 |
| #10 | Parker Michael | 4 |
| Publication | Filing date | Title |
|---|---|---|
| KR20150132515A | Multiple zone heater | |
| US2013250471A1 | Compressible conductive element for use in current-carrying structure | |
| US2013186940A1 | Hermetically joined ceramic assemblies and low temperature method for hermetically joining ceramic materials | |
| WO2013081675A1 | Method for manufacturing and repairing semiconductor processing equipment and equipment produced using same |