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CURAMIK ELECTRONICS GMBH

Overview
  • Total Patents
    140
  • GoodIP Patent Rank
    231,019
About

CURAMIK ELECTRONICS GMBH has a total of 140 patent applications. Its first patent ever was published in 1994. It filed its patents most often in Germany, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, audio-visual technology and materials and metallurgy are SAMSUNG ELECTRIC MACHINES CO L, AMERICAN LAVA CORP and UZOH CYPRIAN EMEKA.

Patent filings per year

Chart showing CURAMIK ELECTRONICS GMBHs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Schulz-Harder Juergen 74
#2 Meyer Andreas 35
#3 Exel Karl 34
#4 Schmidt Karsten 26
#5 Schulz-Harder Jurgen 12
#6 Schulz-Harder Juergen Dr 10
#7 Hammel Ernst 9
#8 Ernstberger Erich 8
#9 Rogg Alexander 8
#10 Schulz-Harder Jürgen 7

Latest patents

Publication Filing date Title
WO2013143534A1 Tunnel furnace
DE102013102797A1 Tunnel furnace for heat treatment of material to be treated, has transport element lubricants and turnable and/or transferable stocks or supporting items or rolling elements are provided between carrier and furnace main portion
HU1400149A2 Packaging unit for substrates
DE102012104903A1 Process for producing metal-ceramic substrates and metal-ceramic substrate produced by this process
DE102012102090A1 Thermoelectric generator module, metal-ceramic substrate and method for producing a metal-ceramic substrate
DE102012101057A1 Process for the preparation of DCB substrates
DE102010049499A1 Metal-ceramic substrate and method for producing such a substrate
DE102010018668A1 Packaging unit for metal-ceramic substrates
DE102010007919A1 Process for producing metal-ceramic composite materials, in particular metal-ceramic substrates, and ceramic composite material produced by this process, in particular metal-ceramic substrate
JP2010093001A Method of manufacturing metal-ceramic substrate or copper-ceramic substrate, and base used for the method
JP2009091164A Method for manufacturing metal-ceramic substrate or copper-ceramic substrate, and support for use in the method
EP1989741A2 Method for the production of peltier modules
CN101395730A Method for the production of peltier modules, and peltier module
DE102007008027A1 Diode laser arrangement and method for producing such an arrangement
DE102006011743A1 Method for producing Peltier modules and Peltier module
DE102006009159A1 Composite substrate production involves connecting metal-ceramic substrate and/or copper-ceramic substrate with upper surface side of metallic carrier through sintering and under application of metallic sintering material
DE102005061049A1 Metal-ceramic substrate
DE102005048492A1 Electric module
DE102005042554A1 Metal-ceramic substrate and method for producing a metal-ceramic substrate
DE102005013457A1 Electronic device, for example computer with a cooling system