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REVERA INC

Overview
  • Total Patents
    47
  • GoodIP Patent Rank
    177,010
About

REVERA INC has a total of 47 patent applications. Its first patent ever was published in 1993. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets measurement, electrical machinery and energy and semiconductors are LEYBOLD INFICON INC, HITACHI HIGH-TECH CORP and NOVA MEASURING INSTR INC.

Patent filings per year

Chart showing REVERA INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Schueler Bruno 13
#2 Reed David A 11
#3 Schueler Bruno W 11
#4 Larson Paul E 8
#5 Pois Heath A 7
#6 Watson David G 6
#7 Smedt Rodney 6
#8 Moulder John F 5
#9 Reed David 5
#10 Pike Alger C 5

Latest patents

Publication Filing date Title
CN106574904A Feed-forward of multi-layer and multi-process information using XPS and XRF technologies
CN106461428A Silicon germanium thickness and composition determination using combined xps and xrf technologies
KR20160111483A Methods and systems for measuring periodic structures using multi-angle x-ray reflectance scatterometry (xrs)
WO2015026824A1 Methods and systems for fabricating platelets of a monochromator for x-ray photoelectron spectroscopy
US2009268877A1 Method and system for calibrating an X-ray photoelectron spectroscopy measurement
CN101523171A Method and system for non-destructive distribution profiling of an element in a film
US7456399B1 Calibrating multiple photoelectron spectroscopy systems
US2007069125A1 Photoelectron spectroscopy apparatus and method of use
US7359487B1 Diamond anode
US2007010973A1 Method and system for non-destructive distribution profiling of an element in a film
US2006243904A1 Determining layer thickness using photoelectron spectroscopy
US2006247899A1 Techniques for analyzing data generated by instruments
US2006190916A1 Semiconductor substrate processing method and apparatus
US7561438B1 Electronic device incorporating a multilayered capacitor formed on a printed circuit board
KR20070051252A Nondestructive characterization of thin films using measured basis spectra and/or based on acquired spectrum
US2004135081A1 Nondestructive characterization of thin films using measured basis spectra
US2004125913A1 Nondestructive characterization of thin films based on acquired spectrum
EP1219956A2 Method for providing a substantially uniform surface potential on an insulating specimen