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RECIF SA

Overview
  • Total Patents
    77
About

RECIF SA has a total of 77 patent applications. Its first patent ever was published in 1984. It filed its patents most often in France, United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, machines and machine tools are SQUARE CORP H, WILLIAM SHOCKLEY and DYNAMIC MICROSYSTEMS SEMICONDU.

Patent filings per year

Chart showing RECIF SAs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Poli Bernard 34
#2 Chincholle Gerard 23
#3 Gaudon Alain 20
#4 Astegno Pierre 17
#5 Lero Christophe 10
#6 Esteve Ekaterina 7
#7 Haddad Florent 6
#8 Berunaaru Pori 6
#9 Fresquet Gilles 5
#10 Ching Gil 5

Latest patents

Publication Filing date Title
EP1610927A2 Device for gripping a semiconductor plate through a transfer opening, using the closure of the opening
TW200410763A Substrate processing apparatus for processing substrates using dense phase gas and sonic waves
CN1698178A System of transporting and storing containers of semiconductor wafers and transfer mechanism
EP1470523A1 Method and device for identification of characters written on a semiconductor sheet comprising at least one alignment marker
TW419772B Process and device for changing the position of a semiconductor wafer
EP0857336A1 Method and apparatus for identifying characters on a plurality of silicon wafers
EP0724753A1 Methods and devices for identifying characters written on substrates
US5280979A Tip for a vacuum pipette with improved electrostatic discharge properties
FR2652334A1 Nozzle for vacuum pipette body in particular.
FR2646491A1 Connection device between the body and the nozzle of a vacuum pipette
FR2646492A1 Connecting element between a working tool and a vacuum network
WO9008746A1 Mechanical system for a waste-to-fertilizer conversion process
FR2626261A1 Apparatus for lifting silicon wafers, especially
FR2624778A1 Nozzle for vacuum pipette
FR2624839A1 Apparatus for horizontal transfer of silicon wafers in particular
DE3641728A1 METHOD FOR PRODUCING END PIECES, ESPECIALLY FOR VACUUM DEVICES, AND END PIECES MANUFACTURED THEREFOR
DE3641729A1 CENTRIFUGE DEVICE FOR DRYING SILICON PLATES IN PIECES
FR2606311A2 Automatic closing device for a vacuum gripping pipette
FR2567160A1 Process and means for grasping and conveying silicon wafers