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PROTEC CO LTD

Overview
  • Total Patents
    355
  • GoodIP Patent Rank
    8,380
  • Filing trend
    ⇧ 20.0%
About

PROTEC CO LTD has a total of 355 patent applications. It increased the IP activity by 20.0%. Its first patent ever was published in 1997. It filed its patents most often in Republic of Korea, Taiwan and China. Its main competitors in its focus markets semiconductors, surface technology and coating and audio-visual technology are TORAY ENG CO LTD, VESI SWITZERLAND AG and BESI SWITZERLAND AG.

Patent filings per year

Chart showing PROTEC CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hong Seung Min 116
#2 Ko Youn Sung 43
#3 Lee Yong Hun 27
#4 Lee Soo Jin 23
#5 Lee Hansung 20
#6 Kim Min Sun 17
#7 Ahn Geunsik 17
#8 Moon Chan Young 16
#9 Choi Sung Hwan 14
#10 Kang Sung Min 13

Latest patents

Publication Filing date Title
KR20210002406A System for Laser Bonding of Flip Chip
KR20190116235A Apparatus for Bonding Semiconductor Chip and Method for Bonding Semiconductor Chip
KR20200127678A System for Laser Bonding of Flip Chip
KR102163176B1 Viscous Liquid Dispensing Apparatus Using 3 Dimensional Scanner
KR20200126636A Pump for Dispensing Viscous Liquid
KR20200126637A Dispensing Apparatus Having Multi Pumps
CN110355016A Wafer scale distributor
KR20200107370A Coupling Apparatus and Method for Drum Container
KR20200093936A Laser Bonding Apparatus for Semi-conductor Chip in Nitrogen Atmosphere
KR20200085077A System for Laser Bonding of Flip Chip
KR20200085078A Mask Changing Unit for Laser Bonging Apparatus
KR20200084174A Laser Bonding Apparatus for Semi-conductor Chip
KR102078936B1 Method of Mounting Conductive Ball
KR102078935B1 Apparatus for Mounting Conductive Ball
WO2019103299A1 Laser apparatus for printed electronics system and operating method thereof
KR20200025148A Viscous Liquid Dispensing Method Using 3 Dimensional Scanner
KR20190118092A Side Sealing Dispenser
KR20190118094A Wafer Level Dispenser
KR20190118093A Tilting Dispenser
KR20190118360A Dual Head Flip Chip Bonging Method