| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Switzerland | 4 | |
| #2 | Netherlands | 4 | |
| #3 | Canada | 3 | |
| #4 | Japan | 3 | |
| #5 | Germany | 2 | |
| #6 | France | 2 | |
| #7 | United States | 2 |
| # | Industry | |
|---|---|---|
| #1 | Macromolecular chemistry and polymers | |
| #2 | Machines | |
| #3 | Semiconductors | |
| #4 | Basic materials chemistry | |
| #5 | Electrical machinery and energy |
| # | Name | Total Patents |
|---|---|---|
| #1 | Peterson James O | 4 |
| #2 | Rosler Robert K | 4 |
| #3 | Tuller Harold W | 3 |
| #4 | Gore Donald B | 3 |
| #5 | Hunt Earl R | 3 |
| #6 | Riddell Malcolm Norman | 2 |
| #7 | Aaru Aaru Hanto | 2 |
| #8 | Nussbaum Ralph W | 2 |
| #9 | Krigbaum Ronald S | 2 |
| #10 | Hunt Earl Rogers | 2 |
| Publication | Filing date | Title |
|---|---|---|
| NL8001839A | Method for encapsulating a semiconductor device and forming composition suitable for application of the method | |
| US4287105A | Flash resistant epoxy encapsulating composition and process for preparing same | |
| US4292215A | Amino molding compound for cold manifold injection molding | |
| CA1096086A | Mica-filled daillyl molding compounds | |
| CH636366A5 | Epoxy moulding composition, and the use thereof |