ORIGIN COMPANY LTD has a total of 48 patent applications. It increased the IP activity by 1000.0%. Its first patent ever was published in 2014. It filed its patents most often in EPO (European Patent Office), WIPO (World Intellectual Property Organization) and United States. Its main competitors in its focus markets machine tools, surface technology and coating and materials and metallurgy are TEKUTO KK, EVANA TECH UAB and SHIMOI HIDEKI.
# | Country | Total Patents | |
---|---|---|---|
#1 | EPO (European Patent Office) | 14 | |
#2 | WIPO (World Intellectual Property Organization) | 12 | |
#3 | United States | 9 | |
#4 | Republic of Korea | 7 | |
#5 | China | 6 |
# | Industry | |
---|---|---|
#1 | Machine tools | |
#2 | Surface technology and coating | |
#3 | Materials and metallurgy | |
#4 | Audio-visual technology | |
#5 | Mechanical elements | |
#6 | Chemical engineering | |
#7 | Civil engineering |
# | Name | Total Patents |
---|---|---|
#1 | Ozawa Naoto | 21 |
#2 | Suzuki Takayuki | 19 |
#3 | Okubo Tatsuo | 10 |
#4 | Shiraishi Arisa | 9 |
#5 | Furusawa Mitsuyasu | 6 |
#6 | Hayashi Toshihiko | 6 |
#7 | Shinohara Shinichi | 6 |
#8 | Yamazaki Miya | 5 |
#9 | Matsuda Jun | 5 |
#10 | Akama Hiroshi | 4 |
Publication | Filing date | Title |
---|---|---|
WO2021020213A1 | Solder-attached product manufacturing device, and solder-attached product manufacturing method | |
WO2021065022A1 | Bidirectional torque limiter | |
US2020406209A1 | Reducing gas supplying apparatus and method for manufacturing processed target object | |
KR20200125651A | Flux, solder paste, soldering process, soldering product manufacturing method, BGA package manufacturing method | |
EP3357629A1 | Solder paste for reduction gas, and method for producing soldered product | |
EP3257614A1 | Method of manufacturing welded article and welded article |