| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 2 | |
| #2 | EPO (European Patent Office) | 2 | |
| #3 | WIPO (World Intellectual Property Organization) | 2 | |
| #4 | Brazil | 1 | |
| #5 | Germany | 1 | |
| #6 | Hungary | 1 | |
| #7 | Republic of Korea | 1 | |
| #8 | Mexico | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Semiconductors |
| # | Technology | |
|---|---|---|
| #1 | Soldering, welding and flame cutting | |
| #2 | Semiconductor devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Loidolt Angela | 5 |
| #2 | Daoud Haneen | 5 |
| #3 | Reichelt Stephan | 5 |
| #4 | Walter Herrmann | 4 |
| #5 | Wald Hermann | 4 |
| #6 | Pfarr Roland | 4 |
| #7 | Hermann Pfarr Roland Walter He | 1 |
| #8 | Herrmann Walter | 1 |
| Publication | Filing date | Title |
|---|---|---|
| DE102017004626A1 | Lead-free solder foil for diffusion soldering | |
| HU0402010A2 | Lead-free soft solder |