| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 3 | |
| #2 | EPO (European Patent Office) | 3 | |
| #3 | Republic of Korea | 3 | |
| #4 | United States | 3 | |
| #5 | WIPO (World Intellectual Property Organization) | 3 | |
| #6 | Russian Federation | 2 | |
| #7 | Japan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Semiconductors | |
| #3 | Optics | |
| #4 | Environmental technology | |
| #5 | Machines |
| # | Name | Total Patents |
|---|---|---|
| #1 | Kimbaras Dziugas | 17 |
| #2 | Vanagas Egidijus | 17 |
| #3 | Veselis Laurynas | 11 |
| #4 | Bazilevicius Karolis Zilvinas | 5 |
| #5 | Egidijus Vanagas | 1 |
| #6 | Dziugas Kimbaras | 1 |
| #7 | Kazakevicius Aivaras | 1 |
| #8 | Laurynas Veselis | 1 |
| Publication | Filing date | Title |
|---|---|---|
| JP2020021968A | Method of scribing semiconductor workpiece | |
| WO2018011618A1 | Method and system for cleaving a substrate with a focused converging ring-shaped laser beam | |
| CN109641315A | Laser processing and a kind of system cut using Multi sectional condenser lens or cut wafer | |
| WO2016193786A1 | Method of laser scribing of semiconductor workpiece using divided laser beams | |
| US2017250113A1 | Method of laser processing for substrate cleaving or dicing through forming “spike-like” shaped damage structures |