OPTOLANE TECHNOLOGIES INC has a total of 11 patent applications. Its first patent ever was published in 2013. It filed its patents most often in Republic of Korea, EPO (European Patent Office) and United States. Its main competitors in its focus markets semiconductors, measurement and biotechnology are BIOPHILIA INC, AGILOME INC and JFE TECHNO RES CORP.
# | Country | Total Patents | |
---|---|---|---|
#1 | Republic of Korea | 7 | |
#2 | EPO (European Patent Office) | 2 | |
#3 | United States | 1 | |
#4 | WIPO (World Intellectual Property Organization) | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Measurement | |
#3 | Biotechnology | |
#4 | Audio-visual technology | |
#5 | Chemical engineering |
# | Technology | |
---|---|---|
#1 | Analysing materials | |
#2 | Semiconductor devices | |
#3 | Measuring microorganism processes | |
#4 | Microbiology | |
#5 | Chemical or physical laboratory devices | |
#6 | Advertising | |
#7 | Television |
# | Name | Total Patents |
---|---|---|
#1 | Jeon In Gyun | 7 |
#2 | Lee Do Young | 5 |
#3 | Cho Soo Je | 4 |
#4 | Kim Songyi | 2 |
#5 | Eom Jae Won | 1 |
#6 | Choi Kyung Hak | 1 |
#7 | Won Jun Ho | 1 |
#8 | Choi An Shik | 1 |
#9 | Han Chang Hoon | 1 |
Publication | Filing date | Title |
---|---|---|
KR20160112941A | Pcr module, pcr system having the same, and method of testing using the same | |
KR20160036480A | A manufacturing method for biochip improved sensitivity property for fluorescence signal and the biochip manufactured by the same | |
KR20160111823A | Display device, method of manufacturing the same, and method of hmd interface using the same | |
KR101569515B1 | A biochip including a side- light type light emitting device and a manufacturing method thereof | |
KR20140133022A | Method for manufacturing through via of interposer and semiconductor package comprising interposer | |
US2016152941A1 | Device for analyzing cells and monitoring cell culturing and method for analyzing cells and monitoring cell culturing using same | |
KR20140100178A | Wafer level packaging method of electronic device and wafer level package | |
KR20140100179A | Wafer level packaging method of electronic device |