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NIKO SEMICONDUCTOR CO LTD

Overview
  • Total Patents
    193
  • GoodIP Patent Rank
    58,418
  • Filing trend
    0.0%
About

NIKO SEMICONDUCTOR CO LTD has a total of 193 patent applications. It increased the IP activity by 0.0%. Its first patent ever was published in 2002. It filed its patents most often in Taiwan, United States and China. Its main competitors in its focus markets electrical machinery and energy, semiconductors and environmental technology are INFINEON TECHNOLOGIES AUSTRIA, ISAHAYA ELECTRONICS CORP and HASHIMOTO TAKAYUKI.

Patent filings in countries

World map showing NIKO SEMICONDUCTOR CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 83
#2 United States 57
#3 China 53

Patent filings per year

Chart showing NIKO SEMICONDUCTOR CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hsieh Chih-Cheng 14
#2 Hsu Hsiu Wen 13
#3 Hsu Ta Ching 9
#4 Leng Chung-Ming 9
#5 Ting Ming Chiang 8
#6 Hsieh Chih Cheng 8
#7 Leng Zhongming 8
#8 Gaowei Tu 8
#9 Xu Dajing 8
#10 Tu Kao Way 7

Latest patents

Publication Filing date Title
TWI716075B Power module
CN112287506A Simulation model of power metal oxide semiconductor transistor
TWI702534B Simulation method of power metal oxide semiconductor transistor
TWI678773B Power chip scale package structure
CN111146157A Power chip packaging structure
CN109756213A Device in one-way on state
TW201919340A One-direction conduction device
TWI606670B Brake energy recovery module
TWI588919B Semiconductor package structure and manufacturing method thereof
TW201640623A Chip package structure and manufacturing method thereof
TW201717330A Chip package structure
TW201628144A Manufacturing method of ultra-thin semiconductor device package assembly
TW201616618A Fan-out wafer level chip package structure and manufacturing method thereof
TW201616556A Manufacturing method of wafer level chip scale package structure
TW201535624A Package structure and packaging method of wafer level chip scale package
CN104916597A Wafer-level fan-out chip packaging method and packaging structure
CN104734478A Power supply changeover device and control chip thereof
TW201526511A Power conversion apparatus and control chip thereof
CN103872887A Low-power-consumption leakage circuit and AC (Alternating Current) conversion system with same
TW201427216A Low power bleeder circuit and ac converter having the same