NIHON SUPERIOR SHA CO LTD innovation strategy

Patent filings in countries

#	Country	Total Patents
#1	EPO (European Patent Office)	9
#2	WIPO (World Intellectual Property Organization)	9
#3	China	6
#4	United States	5
#5	Malaysia	4
#6	Australia	2
#7	Canada	2
#8	Hong Kong	2
#9	Brazil	1
#10	Indonesia	1
#11	Mexico	1
#12	Slovakia	1
#13	Taiwan	1

#	Technology
#1	Soldering, welding and flame cutting
#2	Alloys
#3	Casings and printed circuits
#4	Metal production and refining
#5	Climate change mitigation in goods production
#6	Unspecified technologies
#7	Metal tempering

Publication	Filing date	Title
WO2009051181A1	2008-10-16	Lead-free solder alloy
EP2243590A1	2008-02-22	Method of regulating nickel concentration in lead-free solder containing nickel
MY150455A	2008-01-08	Solder free from lead for additional supply and method of regulating cu concentration and ni concentration in solder bath
MY151061A	2008-01-08	Method of depositing copper in lead-free solder, method of granulating (cux)6sn5 compound and method of separating the same, and method of recovering tin
MY143560A	2006-12-14	Deposition and separation apparatus for excess copper in lead-free solder
CN101589162A	2006-12-14	Apparatus for precipitation/separation of excess copper in lead-free solder
EP1908853A1	2006-07-25	Method of depositing copper in lead-free solder and method of recovering tin
WO9948639A1	1999-03-15	Leadless solder
CN1262638A	1999-03-15	Leadless solder