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NIHON SUPERIOR CO LTD

Overview
  • Total Patents
    142
  • GoodIP Patent Rank
    15,721
  • Filing trend
    ⇧ 25.0%
About

NIHON SUPERIOR CO LTD has a total of 142 patent applications. It increased the IP activity by 25.0%. Its first patent ever was published in 1994. It filed its patents most often in Japan, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets machine tools, materials and metallurgy and electrical machinery and energy are HARRIS JOSEPH W, HYUNDAI WELDING CO LTD and MA JUSHENG.

Patent filings per year

Chart showing NIHON SUPERIOR CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Nishimura Tetsuro 101
#2 Nishimura Takatoshi 41
#3 Nishimura Tetsuo 34
#4 Akaiwa Tetsuya 14
#5 Suenaga Shoichi 11
#6 Suenaga Masakazu 11
#7 Fukami Takuo 11
#8 Miyaoka Yukinori 6
#9 Jonoshita Yuko 6
#10 Nogita Kazuhiro 6

Latest patents

Publication Filing date Title
WO2021049643A1 Lead-free solder alloy
WO2021045131A1 Solder paste and solder bonded body
WO2021025081A1 Solder-metal mesh composite material and method for producing same
WO2021020309A1 Preform solder and solder-bound body formed using said preform solder
WO2020209384A1 Lead-free solder alloy and solder joint part
WO2020111273A1 Lead-free solder alloy
WO2020100614A1 Solder joint part and production method therefor
JP2020196040A Preliminary soldering device and preliminary soldering method
JP2020157326A Joining method of lead free solder material
JP2019155476A Solder joint
JP2020123554A Negative electrode material for lithium ion secondary battery and manufacturing method thereof
JP2020122175A Joint material using nano-silver particles and joint method
JP2020082117A Solder composition for laser soldering, and solder joint part
JP2020066041A Production method of solder joint
JP2020025982A Lead-free solder alloy
JP2020006402A Low residue solder paste
JP2019209361A Lead-free solder joint material and joint part thereof
JP2019202345A Lead-free soldering alloy
WO2018198838A1 Solder sample management system, solder management server device, and solder sample management method
WO2018181690A1 Lead-free solder alloy and solder joint