| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 4 | |
| #2 | Japan | 3 | |
| #3 | China | 2 | |
| #4 | EPO (European Patent Office) | 2 | |
| #5 | United Kingdom | 2 | |
| #6 | Hong Kong | 2 | |
| #7 | Taiwan | 2 | |
| #8 | WIPO (World Intellectual Property Organization) | 2 | |
| #9 | Brazil | 1 | |
| #10 | Czechia | 1 | |
| #11 | Hungary | 1 | |
| #12 | Republic of Korea | 1 | |
| #13 | Mexico | 1 | |
| #14 | New Zealand | 1 | |
| #15 | Poland | 1 | |
| #16 | Singapore | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Materials and metallurgy | |
| #3 | Audio-visual technology | |
| #4 | Surface technology and coating |
| # | Technology | |
|---|---|---|
| #1 | Soldering, welding and flame cutting | |
| #2 | Alloys | |
| #3 | Casings and printed circuits | |
| #4 | Coating metallic material |
| # | Name | Total Patents |
|---|---|---|
| #1 | Chew Kai Hwa | 15 |
| #2 | Pan Wei Chih | 13 |
| #3 | Kho Vincent Yue Sern | 7 |
| #4 | Chew Kaihwa | 5 |
| #5 | Chuu Kai Fua | 2 |
| #6 | Chih Pan Wei | 2 |
| #7 | Hwa Chew Kai | 1 |
| #8 | Kaihwa Chew | 1 |
| #9 | Kwa Chew Kai | 1 |
| #10 | Kho Yue Sern | 1 |
| Publication | Filing date | Title |
|---|---|---|
| GB0804138D0 | A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy | |
| GB0423860D0 | Improvements in ro relating to solders | |
| TW498009B | Improvements in or relating to solders | |
| SG139507A1 | Improvements in or relating to solders | |
| JP2002153991A | Solder material |