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NGK ELECTRONICS DEVICES INC

Overview
  • Total Patents
    56
  • GoodIP Patent Rank
    28,930
  • Filing trend
    ⇧ 25.0%
About

NGK ELECTRONICS DEVICES INC has a total of 56 patent applications. It increased the IP activity by 25.0%. Its first patent ever was published in 2013. It filed its patents most often in Japan, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets semiconductors, audio-visual technology and surface technology and coating are CASIO MICRONICS CO LTD, KIKUCHI TAKASHI and TATSUTA DENSEN KK.

Patent filings in countries

World map showing NGK ELECTRONICS DEVICES INCs patent filings in countries
# Country Total Patents
#1 Japan 31
#2 WIPO (World Intellectual Property Organization) 15
#3 China 4
#4 EPO (European Patent Office) 3
#5 United States 3

Patent filings per year

Chart showing NGK ELECTRONICS DEVICES INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kubo Noboru 9
#2 Ishizaki Masato 9
#3 Ano Seiji 5
#4 Mori Kiichiro 5
#5 Kawamura Takashi 4
#6 Gotou Naoki 4
#7 Goto Naoki 4
#8 Miyajima Shin 3
#9 Kamae Takayuki 3
#10 Arakawa Fumihiko 3

Latest patents

Publication Filing date Title
WO2021049111A1 Terminal structure, package, and method for manufacturing terminal structure
WO2020261730A1 Package, and method for manufacturing power semiconductor module
WO2020261731A1 Package, and method for manufacturing power semiconductor module
WO2020230457A1 Power semiconductor module and method for manufacturing same
WO2020217787A1 Metal member and production method therefor
WO2020208999A1 Electronic component accommodating package
JP2020007225A Cu/CERAMIC SUBSTRATE
CN112119489A Wiring substrate, package, and module
JP2019073437A Cu/CERAMIC SUBSTRATE
CN111133570A Sheet-like substrate and method for manufacturing sheet-like substrate
WO2019093269A1 Cover member and electronic device
EP3684147A1 Connection structure for wiring substrate and flexible substrate, and package for storing electronic components
WO2018225511A1 Cover member, method for producing electronic device, and electronic device
WO2018164206A1 Insulation circuit board terminal, insulation circuit board composite body, and semiconductor device composite body
JP2018206879A Manufacturing method of package for housing electronic component and package for housing electronic component
JP2018206820A Semiconductor package and metal terminal joint structure
JP2018195716A Heat dissipating substrate, semiconductor package including the same, method of manufacturing the same, and method of manufacturing semiconductor device
EP3477693A1 High-frequency ceramic substrate and high-frequency semiconductor element housing package
JP2018117057A Wiring board, package for storing electronic component, and electronic device
JP2018101720A Multi-piece wiring board and manufacturing method of the same