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TATSUTA DENSEN KK

Overview
  • Total Patents
    1,392
  • GoodIP Patent Rank
    16,421
About

TATSUTA DENSEN KK has a total of 1,392 patent applications. Its first patent ever was published in 1968. It filed its patents most often in Japan, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets audio-visual technology, semiconductors and electrical machinery and energy are SONY CHEMICAL CORP, TATSUTA SYSTEM ELECTRONICS CO and SONY CHEMICALS.

Patent filings per year

Chart showing TATSUTA DENSEN KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Onishi Kihachi 202
#2 Murakami Hisatoshi 148
#3 Wakita Shinichi 139
#4 Terada Tsunehiko 132
#5 Morimoto Shohei 100
#6 Nakaya Fumio 89
#7 Yamazaki Takeshi 87
#8 Shimada Toshinori 77
#9 Fujio Nobuhiro 76
#10 Okumura Koichi 73

Latest patents

Publication Filing date Title
JP2016040852A Shield film, shield printed wiring board, and method for manufacturing shield printed wiring board
JP2016029748A Method for manufacturing shield printed wiring board
WO2016084342A1 Conductive paste and thermocouple using same
WO2016017644A1 Conductive composition and conductive sheet provided with same
WO2015198567A1 Sulfur-removing material, and purification column and organic-matter-analysis pretreatment method using said sulfur-removing material
CN106465568A Electroconductive adhesive film, printed circuit board, and electronic device
WO2015115241A1 Wire bonding and method for producing same
WO2015098059A1 Material for bonding electronic component, and method for bonding electronic component
JP2016040760A Shield wire
JP2016033475A Pressure-sensitive sheet and detector
JP2016030020A Biomedical electrode tool
JP2016030021A Biomedical electrode tool
JP2016025114A Bonding wire
JP2016016460A Cutting device
JP2015228300A Withstand voltage test for insulated electric wire
US2016120077A1 Electromagnetic wave shield film, printed wiring board using same, and rolled copper foil
WO2014192490A1 Shape-retaining film, and shape-retaining-type flexible circuit board provided with same shape-retaining film
JP2014135522A Shield film, shield printed wiring board and method of manufacturing shield printed wiring board
JP2015210883A Metal-coated resin particle and conductive adhesive using the same
JP2015192073A Electromagnetic wave shielding film, shielded printed wiring board and method of producing electromagnetic wave shielding film