One-component type epoxy resin for sealing semiconductor
KR20170123394A
Coating composition with improved thermal conductivity and method of forming coating film
KR20170015867A
Light emitting device
KR20170012724A
Light emitting device
KR101452981B1
Epoxy resin composition, process for producing the same, substrate made therefrom for photosemiconductor element mounting, and photosemiconductor device having the same
KR101405532B1
Epoxy resin composition, And Photosemiconductor device having the same
KR20140120732A
Coating solution, method of preparing thereof, method of preparing coated glass using the coating solution and coated glass using the same
KR20140118387A
Catechol graft copolymer, complex including the same and method for preparing thereof
CN103562290A
Thermosetting resin composition for light reflection, preparation method thereof, reflecting plate for loading photonic semiconductor prepared therefrom, and photonic semiconductor device containing same
KR101092015B1
Thermosetting resin composition for light reflection, process for producing the same, substrate made therefrom for photosemiconductor element mounting, and photosemiconductor device
KR100967613B1
Semi-crosslinked epoxy resin composition and method for preparation of the same
