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NEC TOPPAN CIRCUIT SOLUTIONS

Overview
  • Total Patents
    113
About

NEC TOPPAN CIRCUIT SOLUTIONS has a total of 113 patent applications. Its first patent ever was published in 2000. It filed its patents most often in Japan, United States and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, audio-visual technology and machines are LAMINA LIGHTING INC, AMBIT MICROSYSTEMS ZHONGSHAN LTD and WORLD WISER ELECTRONICS INC.

Patent filings in countries

World map showing NEC TOPPAN CIRCUIT SOLUTIONSs patent filings in countries

Patent filings per year

Chart showing NEC TOPPAN CIRCUIT SOLUTIONSs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kikuchi Hideo 19
#2 Nakamura Hirobumi 14
#3 Ito Toshihide 14
#4 Ishioka Taku 11
#5 Shima Toshiyuki 10
#6 Suzuki Tatsuo 10
#7 Kamata Mitsuaki 9
#8 Ishiguro Kinya 9
#9 Akimoto Yutaka 7
#10 Ofusa Toshio 6

Latest patents

Publication Filing date Title
JP2014015671A Fixture for thin sheet plating and thin sheet plating method
JP2013211431A Electronic component to be built in printed wiring board and manufacturing method of component built-in printed wiring board
JP2013174684A Laser direct exposure system and classification management method for cam data
JP2013175495A Component built-in printed circuit board and method of manufacturing the same
JP2013149904A Method of manufacturing printed-circuit board
JP2013074270A Manufacturing method of rigid flexible printed wiring board
JP2013072125A Plating apparatus and plating method
JP2013051325A Rigid flexible printed wiring board manufacturing method
JP2013041988A Multi-piece printed circuit board, and method of manufacturing printed circuit board
JP2012169523A Manufacturing method of rigid flexible printed wiring board
JP2010251688A Component built-in printed wiring board and manufacturing method of the same
JP2010177523A Design support device of printed circuit board
JP2009302437A Component built-in printed wiring board and method of manufacturing the same
JP2009299084A Continuous carrying type plating apparatus
JP2009290056A Planting pin, and method for manufacturing of printed wiring board with pin
JP2009272417A Setting pin and printed wiring board with the pin
JP2009117753A Printed circuit board with built-in components and its manufacturing method
JP2009088429A Printed wiring board, method of manufacturing the same, and semiconductor device
JP2008311397A Mounting structure of semiconductor element, printed wiring board and its manufacturing method
JP2008300482A Printed wiring board and manufacturing method thereof, and semiconductor device