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MINI PAIRO DENKI KK

Overview
  • Total Patents
    29
About

MINI PAIRO DENKI KK has a total of 29 patent applications. Its first patent ever was published in 1978. It filed its patents most often in Japan. Its main competitors in its focus markets electrical machinery and energy, audio-visual technology and semiconductors are MATSUSHITA ELECTRONIC INDUSTRY, CHOI SEUNG RAK and HONDA MASANOBU.

Patent filings in countries

World map showing MINI PAIRO DENKI KKs patent filings in countries
# Country Total Patents
#1 Japan 29

Patent filings per year

Chart showing MINI PAIRO DENKI KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Maeda Hiroshi 8
#2 Ogino Naoyuki 3
#3 Gaiki Naomichi 3
#4 Tachikawa Teruo 3
#5 Manaka Takeo 3
#6 Aoki Kazuo 2
#7 Matsubara Masaaki 2
#8 Yamamoto Hitoshi 2
#9 Sato Seiichi 2
#10 Morishita Yukihiro 2

Latest patents

Publication Filing date Title
JPH05151856A Proximity switch drive apparatus
JPH05128947A Proximity switch and illuminating switch using proximity switch
JPH05174983A Fluorescent lamp
JPH0487292A Discharging method and small fluorescent lamp using the same discharging method
JPH0469792A Switch for automatic vending machine's merchandise selection and automatic vending machine
JPH0469099A Multi-shaft pulse motor controller
JPH0458794A Step-out detector for pulse motor
JPH03133050A Discharge method and small fluorescent lamp using this method
JPH0352595A Controller for stepping motor
JPH0349424A A/d converter
JPH0352596A Controller for stepping motor
JPH0352598A Controller for stepping motor
JPH02306286A Display system switch device
JPH02291615A Back-lighted switch device particularly for use in automatic vending machine, etc.
JPH02163895A Method for installing automatic vending machine and automatic vending machine to be used for this installation method
JPH0212889A Circuit connecting method and circuit board
JPH01250189A Liquid sensing device and vendor burglarproof device using this device
JPH01302796A Through hole structure of circuit board and method for leaving through hole in soldering process
JPH01157577A Semiconductor light emitting device
JPS6292351A Mounting method and mounting structure for lead wire to circuit substrate