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MICRON TECHNOLOGIES INC

Overview
  • Total Patents
    35
About

MICRON TECHNOLOGIES INC has a total of 35 patent applications. Its first patent ever was published in 1992. It filed its patents most often in United States, Australia and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, computer technology and machines are SEKINE KATSUYUKI, HIGASHITANI MASAAKI and TC LAB INC.

Patent filings in countries

World map showing MICRON TECHNOLOGIES INCs patent filings in countries

Patent filings per year

Chart showing MICRON TECHNOLOGIES INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Manning Troy A 4
#2 Sandhu Gurtej S 3
#3 Kiehlbauch Mark 2
#4 Baker R Jacob 2
#5 Taylor Ted 2
#6 Forbes Leonard 2
#7 Merritt Todd A 2
#8 Di Francesco Walter 1
#9 Cathey Jr David A 1
#10 Mclaury Loren L 1

Latest patents

Publication Filing date Title
US2010127409A1 Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers
US2009273981A1 Methods and apparatuses for programming flash memory using modulated pulses
US2008057724A1 Selective etch chemistries for forming high aspect ratio features and associated structures
US2005212033A1 Memory device with high dielectric constant gate dielectrics and metal floating gates
US7619669B2 Power savings with multiple readout circuits
US7253076B1 Methods for forming and integrated circuit structures containing ruthenium and tungsten containing layers
US6198168B1 Integrated circuits using high aspect ratio vias through a semiconductor wafer and method for forming same
US5923040A Wafer sample retainer for an electron microscope
US5956611A Field emission displays with reduced light leakage
US5898625A Fast power up reference voltage circuit and method
US5990903A Method and apparatus for performing chroma key, transparency and fog operations
AU6154296A Distributed write data drivers for burst memories
US6084302A Barrier layer cladding around copper interconnect lines
US5756404A Two-step nitride deposition
US5634974A Method for forming hemispherical grained silicon
US5698455A Method for predicting process characteristics of polyurethane pads
US5323350A Integrated circuit memory with dual P-sense amplifiers associated with each column line
US5196360A Methods for inhibiting outgrowth of silicide in self-aligned silicide process