CHANG WEN YAO has a total of 11 patent applications. It increased the IP activity by 66.0%. Its first patent ever was published in 2016. It filed its patents most often in United States, Germany and Republic of Korea. Its main competitors in its focus markets audio-visual technology, basic materials chemistry and surface technology and coating are LI LONGKAI, GUANGZHOU MEADVILLE ELECTRONICS CO LTD and FERROZELL SACHS & CO GMBH.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 8 | |
#2 | Germany | 2 | |
#3 | Republic of Korea | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Basic materials chemistry | |
#3 | Surface technology and coating | |
#4 | Machines | |
#5 | Semiconductors | |
#6 | Furniture and games | |
#7 | Consumer goods |
# | Technology | |
---|---|---|
#1 | Casings and printed circuits | |
#2 | Adhesives | |
#3 | Layered products | |
#4 | Unspecified technologies | |
#5 | Toys | |
#6 | Protective garments | |
#7 | Semiconductor devices |
# | Name | Total Patents |
---|---|---|
#1 | Chang Wen Yao | 11 |
Publication | Filing date | Title |
---|---|---|
US2020163209A1 | Circuit board with substrate made of silicone | |
DE102018106647A1 | SILICULAR COMPOSITE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | |
US2019270294A1 | Silicon contained integrated structure and the method for forming the same | |
KR20190087905A | A circuit board of substrate made of a silica gel plate and manufacturing method thereoff | |
US10278283B1 | Method for forming a circuit board with a substrate made of silicon | |
US2019191554A1 | Circuit board with a substrate made of silicon and the methods for forming the same | |
DE102017128630A1 | Pcb with a silicon substrate and manufacturing method therefor | |
US2018161688A1 | Soft building block assembly |