| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 8 | |
| #2 | Germany | 4 | |
| #3 | WIPO (World Intellectual Property Organization) | 3 | |
| #4 | EPO (European Patent Office) | 2 | |
| #5 | Canada | 1 | |
| #6 | China | 1 | |
| #7 | United Kingdom | 1 | |
| #8 | Singapore | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machines | |
| #2 | Computer technology | |
| #3 | Semiconductors | |
| #4 | Surface technology and coating | |
| #5 | Electrical machinery and energy | |
| #6 | Audio-visual technology | |
| #7 | Telecommunications | |
| #8 | Consumer goods |
| # | Technology | |
|---|---|---|
| #1 | Unspecified technologies | |
| #2 | Semiconductor devices | |
| #3 | Data recognition and presentation | |
| #4 | Layered products | |
| #5 | Casings and printed circuits | |
| #6 | Magnets and transformers | |
| #7 | Antennas | |
| #8 | Books | |
| #9 | Installation of electric cables |
| # | Name | Total Patents |
|---|---|---|
| #1 | Michalk Manfred | 21 |
| #2 | Griesbach Andreas | 1 |
| #3 | Hofmann Franziska | 1 |
| Publication | Filing date | Title |
|---|---|---|
| DE102009041359A1 | Circuit arrangement with a predetermined electrical capacity | |
| DE102009013826A1 | Circuit arrangement, method for electrical and / or mechanical connection and apparatus for applying connecting elements | |
| DE102009012255A1 | circuitry | |
| DE10105164A1 | Semiconductor chip contacting method has chip transfer tool mounting semiconductor chips in given layout on flexible substrate before fixing via common chip fixing tool | |
| SG47091A1 | Contactless data carrier and process for the manufacture thereof | |
| WO9402960A1 | Miniature housing for electronic components |