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FREESIA MAKUROSU KK

Overview
  • Total Patents
    17
  • GoodIP Patent Rank
    219,866
  • Filing trend
    ⇩ 100.0%
About

FREESIA MAKUROSU KK has a total of 17 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2009. It filed its patents most often in Japan and China. Its main competitors in its focus markets audio-visual technology, surface technology and coating and machines are FREESIA MACROSS CORP, HANKUK GLASS IND INC and JIAXING CENTURY ELECTRONICS CO LTD.

Patent filings in countries

World map showing FREESIA MAKUROSU KKs patent filings in countries
# Country Total Patents
#1 Japan 16
#2 China 1

Patent filings per year

Chart showing FREESIA MAKUROSU KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Sasaki Beji 16
#2 Beji Sasaki 1

Latest patents

Publication Filing date Title
JP2018160659A Cooling structure, cooling system, heat generation device, and structure
JP2019009247A Wiring board
JP2015063096A Metal foil with carrier and production method of laminated substrate using the metal foil with carrier
JP2015065114A Light emitting module
JP2013034012A Metal foil with carrier
JP2013229280A Metal foil with carrier
JP2013197153A Method of manufacturing substrate for mounting electronic component and substrate for mounting electronic component
JP2012169350A Metal foil with carrier and manufacturing method of multilayer substrate using the same
JP2012104554A Heat radiation structure
JP2011091112A Method for manufacturing electronic component mounting substrate and electronic component mounting substrate
JP2011091111A Method for manufacturing electronic component mounting substrate and electronic component mounting substrate
JP2011091117A Method for manufacturing electronic component mounting substrate and electronic component mounting substrate
JP2011091116A Method for manufacturing electronic component mounting substrate and electronic component mounting substrate
JP2011091115A Method for manufacturing electronic component mounting substrate and electronic component mounting substrate
JP2011091113A Method for manufacturing electronic component mounting substrate and electronic component mounting substrate