| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Australia | 1 | |
| #2 | Brazil | 1 | |
| #3 | Canada | 1 | |
| #4 | China | 1 | |
| #5 | Czechia | 1 | |
| #6 | EAPO (Eurasian Patent Organization) | 1 | |
| #7 | EPO (European Patent Office) | 1 | |
| #8 | Israel | 1 | |
| #9 | Mexico | 1 | |
| #10 | Norway | 1 | |
| #11 | United States | 1 | |
| #12 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Yahatz Michael | 10 |
| #2 | Harper James | 10 |
| #3 | Harper Michael Yahatz James | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US5817188A | Fabrication of thermoelectric modules and solder for such fabrication |