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MATTSON THERMAL PRODUCTS GMBH

Overview
  • Total Patents
    68
About

MATTSON THERMAL PRODUCTS GMBH has a total of 68 patent applications. Its first patent ever was published in 1996. It filed its patents most often in Germany, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, surface technology and coating and measurement are ELEMENT SIX TECHNOLOGIES US CORP, HEFEI IRICO EPILIGHT TECHNOLOGY CO LTD and SHANGHAI ZING SEMICONDUCTOR TECH CO LTD.

Patent filings per year

Chart showing MATTSON THERMAL PRODUCTS GMBHs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hauf Markus 17
#2 Roters Georg 11
#3 Striebel Christoph 10
#4 Merkl Christoph 10
#5 Chung Hin Yiu 8
#6 Grandy Michael 5
#7 Graf Ottmar 5
#8 Blersch Werner 4
#9 Mader Roland 4
#10 Sommer Helmut 4

Latest patents

Publication Filing date Title
DE102008012333A1 Device for the thermal treatment of disc-shaped substrates
DE102007058002A1 Device for the thermal treatment of disc-shaped semiconductor substrates
DE102007042779A1 Calibration substrate and method
DE102007035990A1 Method for improving interface reactions on semiconductor surfaces
DE102006036585A1 Method and device for determining measured values
DE102005038672A1 Thermal treatment device for semiconductor substrates, uses reflection element with high reflection capability for radiation from heating device
DE102005035199A1 Method for determining the actual position of a rotation axis of a transport mechanism
DE102005024118A1 Apparatus and method for reducing particles in the thermal treatment of rotating substrates
DE102004053338A1 Reduction of an oxide layer on a surface of a silicon semiconductor
DE102004039443A1 Process for the thermal treatment of disk-shaped substrates
AU2003292147A1 Method for determining the temperature of a semiconductor wafer in a rapid thermal processing system
DE10343692A1 Process for the preparation of a nitrogen-containing layer on a semiconductor or metal surface
DE10329107A1 Method for determining at least one state variable from a model of an RTP system
DE10260672A1 Method and device for the thermal treatment of disk-shaped substrates
DE10255098A1 Method of making a calibration wafer
DE10236896A1 Apparatus and method for the thermal treatment of semiconductor wafers
EP1393354A1 Method and device for the thermal treatment of substrates
WO02095803A1 Method and device for thermally treating substrates
CN1526155A Device for accommodating disk-shaped objects and apparatus for handling objects
DE10156441A1 Device to receive semiconductor wafers for thermal treatment comprises a support with recesses for holding the wafers