DE102008012333A1
|
|
Device for the thermal treatment of disc-shaped substrates
|
DE102007058002A1
|
|
Device for the thermal treatment of disc-shaped semiconductor substrates
|
DE102007042779A1
|
|
Calibration substrate and method
|
DE102007035990A1
|
|
Method for improving interface reactions on semiconductor surfaces
|
DE102006036585A1
|
|
Method and device for determining measured values
|
DE102005038672A1
|
|
Thermal treatment device for semiconductor substrates, uses reflection element with high reflection capability for radiation from heating device
|
DE102005035199A1
|
|
Method for determining the actual position of a rotation axis of a transport mechanism
|
DE102005024118A1
|
|
Apparatus and method for reducing particles in the thermal treatment of rotating substrates
|
DE102004053338A1
|
|
Reduction of an oxide layer on a surface of a silicon semiconductor
|
DE102004039443A1
|
|
Process for the thermal treatment of disk-shaped substrates
|
AU2003292147A1
|
|
Method for determining the temperature of a semiconductor wafer in a rapid thermal processing system
|
DE10343692A1
|
|
Process for the preparation of a nitrogen-containing layer on a semiconductor or metal surface
|
DE10329107A1
|
|
Method for determining at least one state variable from a model of an RTP system
|
DE10260672A1
|
|
Method and device for the thermal treatment of disk-shaped substrates
|
DE10255098A1
|
|
Method of making a calibration wafer
|
DE10236896A1
|
|
Apparatus and method for the thermal treatment of semiconductor wafers
|
EP1393354A1
|
|
Method and device for the thermal treatment of substrates
|
WO02095803A1
|
|
Method and device for thermally treating substrates
|
CN1526155A
|
|
Device for accommodating disk-shaped objects and apparatus for handling objects
|
DE10156441A1
|
|
Device to receive semiconductor wafers for thermal treatment comprises a support with recesses for holding the wafers
|