| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 11 | |
| #2 | Taiwan | 4 | |
| #3 | Republic of Korea | 3 | |
| #4 | EPO (European Patent Office) | 2 | |
| #5 | Singapore | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Chemical engineering | |
| #3 | Machines | |
| #4 | Control | |
| #5 | Machine tools | |
| #6 | Surface technology and coating | |
| #7 | Basic materials chemistry | |
| #8 | Audio-visual technology |
| # | Name | Total Patents |
|---|---|---|
| #1 | Shikami Satoshi | 8 |
| #2 | Izuta Nobuhiko | 7 |
| #3 | Matsuno Kousaku | 6 |
| #4 | Iga Masao | 5 |
| #5 | Kawasaki Masato | 5 |
| #6 | Ueda Takeji | 5 |
| #7 | Kanayasu Jun | 4 |
| #8 | Watatsu Haruru | 4 |
| #9 | Murata Mitsugu | 3 |
| #10 | Kobayashi Noriyuki | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2004194812A1 | Substrate treatment process and apparatus | |
| US2004200806A1 | Regeneration process of etching solution, etching process, and etching system | |
| US2004049301A1 | Apparatus and method for preparing and supplying slurry for CMP machine | |
| TW583355B | Slurry mixing feeder and slurry mixing and feeding method |