LPKF CAD CAM SYSTEME GMBH has a total of 22 patent applications. Its first patent ever was published in 1991. It filed its patents most often in Germany, EPO (European Patent Office) and Japan. Its main competitors in its focus markets audio-visual technology, surface technology and coating and materials and metallurgy are FCM KK, HONMA HIDEO and KOLLMORGEN TECH CORP.
# | Country | Total Patents | |
---|---|---|---|
#1 | Germany | 5 | |
#2 | EPO (European Patent Office) | 5 | |
#3 | Japan | 5 | |
#4 | United States | 4 | |
#5 | China | 1 | |
#6 | Republic of Korea | 1 | |
#7 | WIPO (World Intellectual Property Organization) | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Surface technology and coating | |
#3 | Materials and metallurgy | |
#4 | Machines | |
#5 | Semiconductors | |
#6 | Environmental technology |
# | Name | Total Patents |
---|---|---|
#1 | Kickelhain Joerg | 13 |
#2 | Vitt Bruno | 5 |
#3 | Wenke Stephan | 3 |
#4 | Ieruku Kikeruhain | 2 |
#5 | Kickelhain Joerg Dipl-Ing | 2 |
#6 | Meier Dieter Dipl Chem Dr | 1 |
#7 | Kickelhain Joerg Dipl Ing | 1 |
#8 | Mothe Hood Hammond Jonathan De | 1 |
#9 | Deisner Erich Dipl Phys | 1 |
Publication | Filing date | Title |
---|---|---|
DE19535068A1 | Coating for the structured production of conductor tracks on the surface of electrically insulating substrates, method for producing the coating and of structured conductor tracks | |
EP0727925A1 | Process for structured metallizing of the surface of substrates | |
DE4439108C1 | Method for through-contacting holes in multilayer printed circuit boards | |
DE4417245A1 | High resolution structured metallisation prodn. | |
EP0592938A1 | Process for mounting and contacting electronic components on an insulating support | |
DE4125863A1 | METHOD FOR APPLYING STRUCTURED METAL LAYERS TO GLASS SUBSTRATES | |
DE4103834A1 | Circuit board mfr. by channelling into metallic coating - using laser beam brightness variation in conjunction with orthogonal movements of table under process computer control |