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HONMA HIDEO

Overview
  • Total Patents
    20
About

HONMA HIDEO has a total of 20 patent applications. Its first patent ever was published in 1990. It filed its patents most often in Japan, Hong Kong and Taiwan. Its main competitors in its focus markets surface technology and coating, audio-visual technology and machines are FCM CO LTD, LPKF CAD CAM SYSTEME GMBH and HZO INC.

Patent filings in countries

World map showing HONMA HIDEOs patent filings in countries
# Country Total Patents
#1 Japan 11
#2 Hong Kong 2
#3 Taiwan 2
#4 United States 2
#5 Australia 1
#6 Indonesia 1
#7 Malaysia 1

Patent filings per year

Chart showing HONMA HIDEOs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Honma Hideo 20
#2 Fujinami Tomoyuki 12
#3 Shimizu Satoru 4
#4 Terashima Yoshitaka 4
#5 Hayashi Shinji 4
#6 Ebina Nobuo 4
#7 Kobayashi Takeshi 3
#8 Watanabe Hideto 2
#9 Maniwa Asao 2
#10 Tashiro Katsuhiko 1

Latest patents

Publication Filing date Title
JP2006002246A Method for forming microbump
JP2003253490A Method of plating substrate having via hole and through hole
JP2001295061A Electroless palladium-nickel bath and plating method using the same as well as plated products obtained by the method
JP2000328255A Electroless nickel plating bath and formation of high purity nickel acicular coating film using it
JP2000256866A Electroless nickel plating bath
JP2000212762A Electroless copper plating method
JPH11256349A Plating method with high adhesion property on resin base and copper plating liquid to be used for that
JPH11207184A Palladium mixed catalyst and method for providing palladium catalyst utilizing same
JPH1143797A Method for via-filling
JPH118469A Via-filling method
JPH04116176A Electroless copper plating solution and electroless copper plating method