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LITE ON OPTO TECHNOLOGY CHANGZHOU CO LTD

Overview
  • Total Patents
    44
  • GoodIP Patent Rank
    38,752
  • Filing trend
    ⇧ 300.0%
About

LITE ON OPTO TECHNOLOGY CHANGZHOU CO LTD has a total of 44 patent applications. It increased the IP activity by 300.0%. Its first patent ever was published in 2012. It filed its patents most often in Taiwan and United States. Its main competitors in its focus markets electrical machinery and energy, semiconductors and audio-visual technology are HUGA OPTOTECH INC, INTERLIGHT OPTOTECH CORP and SHENZHEN REFOND OPTOELECTRONICS CO LTD.

Patent filings in countries

World map showing LITE ON OPTO TECHNOLOGY CHANGZHOU CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 35
#2 United States 9

Patent filings per year

Chart showing LITE ON OPTO TECHNOLOGY CHANGZHOU CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chiu Kuo-Ming 9
#2 Lin Chen Hsiu 7
#3 Lin Chen-Hsiu 7
#4 Liang Kai-Chieh 4
#5 Chou Meng-Sung 4
#6 Cheng Wei-Te 4
#7 Hsu Shih Chang 3
#8 Lee Wen 3
#9 Weng Ming Kun 3
#10 Chiu Kuo Ming 3

Latest patents

Publication Filing date Title
TWI692125B Light emitting diode package structure and the manufacture method of the same
TWI676768B Light-emitting unit
TW202023070A Light emitting package structure and manufacturing method thereof
TWI672467B Light-emitting unit
TWI679740B Lead frame array for carrying chips and led package structure with multiple chips
TWI679779B LED package structure, chip carrier, and method for manufacturing thereof
TW202008617A Led package structure
TW201926742A Optical sensor
TWI663754B Lighting structure and manufacturing method thereof
TW201906197A Uv led package structure and manufacturing method thereof
TWI620351B Uv led package structure, uv lighting unit, and manufacturing method of uv lighting unit
TWI624968B Led package structure provided with a predetermined view angle, led package module, manufacturing method therefor
TW201824586A Phosphor sheet supplying module, led package structure, and method for manufacturing led package structure
TWI615999B Led package structure
TW201818877A Optical biosensor module and method for making the same
TW201815345A Optical sensor module and the wearable device thereof
TWI572067B LED package structure
TWI600185B LED package structure with multiple color temperature and method for manufacturing the same
TWI591844B LED structure, LED element and method of manufacturing therefor
TW201743475A Led package structure