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INTERLIGHT OPTOTECH CORP

Overview
  • Total Patents
    38
  • GoodIP Patent Rank
    193,668
About

INTERLIGHT OPTOTECH CORP has a total of 38 patent applications. Its first patent ever was published in 2009. It filed its patents most often in Taiwan, China and EPO (European Patent Office). Its main competitors in its focus markets electrical machinery and energy, semiconductors and audio-visual technology are TSMC SOLID STATE LIGHTING LTD, LITE ON OPTO TECHNOLOGY CHANGZHOU CO LTD and BRIDGELUX INC.

Patent filings in countries

World map showing INTERLIGHT OPTOTECH CORPs patent filings in countries
# Country Total Patents
#1 Taiwan 15
#2 China 11
#3 EPO (European Patent Office) 6
#4 United States 6

Patent filings per year

Chart showing INTERLIGHT OPTOTECH CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Su Hwa 9
#2 Chou Hsi-Yan 8
#3 Cheng Tzu-Chi 6
#4 Liu Hong-Zhi 6
#5 Chou Hsi Yan 5
#6 Cheng Tzu Chi 5
#7 Zheng Ziqi 3
#8 Li Yi-Qun 3
#9 Hu Yu Chou 2
#10 Liu Fu-Chen 2

Latest patents

Publication Filing date Title
US2016315228A1 Light emitting device
US2015285441A1 Illuminant device
US2014362568A1 Light emitting diode bulb
CN104100849A LED (Light-Emitting Diode) lamp bulb
TW201612460A Light emitting diode lamp
US2014252947A1 Illuminant device with over-temperature protecting function
CN103104825A Lamp source module capable of being assembled on various heat dissipation bodies
TW201319458A Light module assembly for different heat sink
CN103000621A Multi-groove light emitting device
TW201310608A Lighting device with multi cavities
TW201208140A Method for fabricating self assembling light emitting diode lens
TW201301949A Light-emitting diode module and method for operating the same
TW201238029A Light emitting device
TW201228045A Light emitting diode packaging structure and method for fabricating the same
CN104851957A Light-emitting diode packaging structure
TW201218449A Light-emitting diode package structure
TW201216504A Light emitting diode device
TW201214659A Light emitting device and manufacturing method thereof
TW201205901A Led light module and manufacturing method thereof
TW201143158A Light emitting diode package structure