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WANG BILY

Overview
  • Total Patents
    61
About

WANG BILY has a total of 61 patent applications. Its first patent ever was published in 1998. It filed its patents most often in United States and Germany. Its main competitors in its focus markets semiconductors, electrical machinery and energy and optics are SHOGEN KODEN KOFUN YUGENKOSHI, ADVANCED OPTOELECTRONIC TECH and HARVATEK CORP.

Patent filings in countries

World map showing WANG BILYs patent filings in countries
# Country Total Patents
#1 United States 60
#2 Germany 1

Patent filings per year

Chart showing WANG BILYs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wang Bily 60
#2 Chuang Jonnie 17
#3 Wu Shih-Yu 13
#4 Wu Wen-Kuei 11
#5 Hsiao Sung-Yi 10
#6 Chen Jack 10
#7 Chen Hsin-Cheng 7
#8 Chen Kuei-Pao 6
#9 Lin John 5
#10 Huang Hui-Yen 4

Latest patents

Publication Filing date Title
US2013163922A1 Light-guiding cover structure
US2012009700A1 Method of manufacturing a led chip package structure
US2012001203A1 Led chip package structure
US2013015372A1 Light-emitting element detection and classification device
US2012106171A1 Led package structure
US2011155436A1 Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same
US2010290664A1 Detection system for detecting appearances of many electronic elements and methods of using the same
US2010264435A1 White light-emitting diode package structure for simplifying package process and method for making the same
US2010264797A1 Reflection-type light-emitting module with high heat-dissipating and high light-generating efficiency
US2010079975A1 Illumination device with a fire-fighting function
US2009206759A1 Controlling system for illumination of a golf course and controlling method thereof
US2009224266A1 LED chip package structure applied to a backlight module and method for making the same
US2008191235A1 Light emitting diode structure with high heat dissipation
US2008246397A1 Manufacturing method of white light led and structure thereof
US2008246185A1 Composition of led frame body and manufacturing method thereof
US2006258031A1 Wafer-level electro-optical semiconductor manufacture fabrication method
US2008012035A1 LED chip package structure and method for manufacturing the same
US2008001816A1 Portable wireless earphone apparatus with a global positioning system
US2007297177A1 Modular lamp structure
US2007290220A1 Package for a light emitting diode and a process for fabricating the same