LIN CHIH-WEI has a total of 13 patent applications. Its first patent ever was published in 2009. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, optics and electrical machinery and energy are POWER CUBESEMI INC, PT PLUS LTD and GUANGZHOU CANSEMI TECH CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 13 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Optics | |
#3 | Electrical machinery and energy | |
#4 | Surface technology and coating | |
#5 | Machines | |
#6 | Measurement | |
#7 | Environmental technology |
# | Name | Total Patents |
---|---|---|
#1 | Lin Chih-Wei | 13 |
#2 | Liu Chung-Shi | 4 |
#3 | Cheng Ming-Da | 4 |
#4 | Hsu Chih-Wan | 3 |
#5 | Wang Min-Cheng | 3 |
#6 | Huang Nung-Te | 3 |
#7 | Lu Wen-Hsiung | 3 |
#8 | Chen Yung-Cheng | 2 |
#9 | Chen Meng-Tse | 2 |
#10 | Huang Kuei-Wei | 2 |
Publication | Filing date | Title |
---|---|---|
US2013093078A1 | Process for forming package-on-package structures | |
US2013062761A1 | Packaging methods and structures for semiconductor devices | |
US2012105789A1 | Display substrate having aperiodically arranged spacers | |
US2011287628A1 | Activation treatments in plating processes | |
US2011254151A1 | Method for fabricating bump structure without UBM undercut | |
US2010270604A1 | Non-volatile memories and methods of fabrication thereof | |
US2011033787A1 | Frame cell for shot layout flexibility |