Learn more

KOSTAT INC

Overview
  • Total Patents
    21
  • GoodIP Patent Rank
    177,491
  • Filing trend
    ⇩ 83.0%
About

KOSTAT INC has a total of 21 patent applications. It decreased the IP activity by 83.0%. Its first patent ever was published in 2000. It filed its patents most often in Republic of Korea, China and Japan. Its main competitors in its focus markets semiconductors, packaging and shipping and macromolecular chemistry and polymers are YANCHENG DONGSHAN PREC MANUFACTURING CO LTD, HUNAN GUOXIN SEMICONDUCTOR TECH CO LTD and OPTOPAC CO LTD.

Patent filings in countries

World map showing KOSTAT INCs patent filings in countries
# Country Total Patents
#1 Republic of Korea 17
#2 China 1
#3 Japan 1
#4 Taiwan 1
#5 United States 1

Patent filings per year

Chart showing KOSTAT INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Bae Jong Hyun 11
#2 Ho Ki Kyeong 7
#3 Lee Yong Hun 6
#4 Nam Chang Weon 4
#5 Lee Jong Kwon 2
#6 Ha Sun Jong 1
#7 Bae Jong Hyeon 1
#8 Ho Ki-Kyeong 1
#9 Kim Jae Chun 1
#10 Lee Yong-Hun 1

Latest patents

Publication Filing date Title
KR20180074621A Tray accommodating semiconductor device and cover therefor
KR20180092269A Winding spacer reel
KR20180092141A Winding spacer reel
KR20170100353A Tray accommodating semiconductor device and cover therefor
KR20140055788A A folded type carrier tape for semiconductor package packing
KR20120104811A A auxiliary tool of tray for semiconductor package capable of heat treatment
KR20100119975A Semiconductor package winding for space reel
KR20100119974A The carrier tape which has a capacity resistance price
KR20080028194A Winding reel for carrier tape using for semiconductor package packing
KR20080021422A Carrier tape having plural row pocket
KR100787187B1 Winding reel for cover tape using for semiconductor package packing
KR20060041605A Polymer resin composition having color
KR20060000251A Polymer composition having conductivity by nano-carbon with hollow
KR20060000250A Carrier tape for semiconductor package
KR20050111995A Cover tape for package of electric parts and method of fabrication the same
KR20020040718A A process for preparing polyolefin foam material having conductivity
KR20020032039A Tray for packing of surface mounting semiconductor package