| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 17 |
| # | Industry | |
|---|---|---|
| #1 | Electrical machinery and energy | |
| #2 | Semiconductors | |
| #3 | Measurement | |
| #4 | Chemical engineering | |
| #5 | Control | |
| #6 | Thermal processes |
| # | Technology | |
|---|---|---|
| #1 | Electric discharge tubes | |
| #2 | Semiconductor devices | |
| #3 | Measuring temperature | |
| #4 | Cleaning | |
| #5 | Measuring length, angles and areas | |
| #6 | Systems controlling non-electric variables | |
| #7 | Plasma technique | |
| #8 | Furnaces |
| # | Name | Total Patents |
|---|---|---|
| #1 | Koshimizu Chishio | 17 |
| #2 | Matsudo Tatsuo | 3 |
| #3 | Yamazawa Yohei | 2 |
| #4 | Yamawaku Jun | 2 |
| #5 | Matsumoto Naoki | 2 |
| #6 | Himori Shinji | 2 |
| #7 | Denpoh Kazuki | 2 |
| #8 | Hirano Taichi | 1 |
| #9 | Iwata Manabu | 1 |
| #10 | Saito Masashi | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2012227955A1 | Substrate temperature control method and plasma processing apparatus | |
| US2010213171A1 | Focus ring heating method, plasma etching apparatus, and plasma etching method |