Learn more

KINWONG ELECTRONIC TECH LONGCHUAN CO LTD

Overview
  • Total Patents
    75
  • GoodIP Patent Rank
    19,348
  • Filing trend
    ⇧ 80.0%
About

KINWONG ELECTRONIC TECH LONGCHUAN CO LTD has a total of 75 patent applications. It increased the IP activity by 80.0%. Its first patent ever was published in 2017. It filed its patents most often in China. Its main competitors in its focus markets audio-visual technology, macromolecular chemistry and polymers and surface technology and coating are ZHUHAI TOPSUN ELECTRONIC TECH CO LTD, SHENZHEN KINWONG ELECTRONIC CO LTD and GARUDA TECHNOLOGY CO LTD.

Patent filings in countries

World map showing KINWONG ELECTRONIC TECH LONGCHUAN CO LTDs patent filings in countries
# Country Total Patents
#1 China 75

Patent filings per year

Chart showing KINWONG ELECTRONIC TECH LONGCHUAN CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Zhang Feilong 13
#2 Liu Wei 11
#3 Tan Xiaolin 10
#4 Wang Yuan 10
#5 Lan Chunhua 9
#6 Luo Qi 9
#7 Sha Weiqiang 8
#8 Zhang Hongwei 6
#9 Zou Ziyu 6
#10 Zhang Baiyong 5

Latest patents

Publication Filing date Title
CN112261800A Manufacturing method of high-heat-dissipation PCB
CN112135441A Grounding metal-based circuit board and preparation method thereof
CN111970836A 5G communication PCB back drilling manufacturing method and system
CN111867236A Circuit board and manufacturing method thereof
CN111812446A PCB testing method and device
CN111757597A Method for manufacturing double-sided anodic aluminum oxide-based circuit board by cover uncovering method
CN111726937A Single-sided double-layer FPC for wireless charging and manufacturing process
CN111800955A Method for double-sided solder resist printing of 5G power amplifier board sheet
CN111757606A Method for manufacturing mixed pressing plate containing high-frequency material and FR4 material
CN111615265A Blind hole processing method of LCP multilayer board
CN111447750A Manufacturing method of super-thick copper PCB
CN111334131A Epoxy composition and heat-conducting aluminum substrate with solder crack resistance
CN111356298A Method for solving carbon powder residue in multilayer FPC (flexible printed circuit) manufacturing process based on front opening window process
CN111343804A Lamination method of multilayer thick copper metal-based circuit board
CN111315154A Manufacturing method of multilayer local thick copper circuit board
CN111225508A Manufacturing method of high-thermal-conductivity flexible circuit board suitable for three-dimensional space and circuit board
CN111246668A Manufacturing method of high-density micro-space high-heat-conductivity ultrathin copper-based circuit board
CN110933853A High dense hole circuit board consent backing plate
CN110996535A Method for manufacturing circuit layer stepped copper thick copper base circuit board by using additive method
CN110785028A Manufacturing method of PCB embedded with ceramic chip and PCB