| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 6 | |
| #2 | United States | 5 | |
| #3 | Singapore | 4 | |
| #4 | Malaysia | 1 |
| # | Industry | |
|---|---|---|
| #1 | Surface technology and coating | |
| #2 | Semiconductors | |
| #3 | Machines | |
| #4 | Packaging and shipping | |
| #5 | Audio-visual technology | |
| #6 | Telecommunications | |
| #7 | Machine tools |
| # | Name | Total Patents |
|---|---|---|
| #1 | Chung Jae Song | 7 |
| #2 | Kwak No-Heung | 3 |
| #3 | Choi Kee Yol | 3 |
| #4 | Nam Gi-Jung | 3 |
| #5 | Jae Song Chung | 2 |
| #6 | Kee Yol Choi | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2008047663A1 | Apparatus and method for bonding anisotropic conductive film using laser beam | |
| SG121961A1 | Feeder belt for strip-shaped parts | |
| JP2006237451A | Apparatus and method for bonding anisotropic conductive film by using laser | |
| SG118253A1 | Fan jet nozzle for use with ultra high pressure liquid phase cleaning media for use in deflashing apparatus | |
| US7124967B2 | Fan jet nozzle for use with ultra high pressure liquid phase cleaning media for use in deflashing apparatus |