XTPL S A has a total of 20 patent applications. It decreased the IP activity by 66.0%. Its first patent ever was published in 2017. It filed its patents most often in WIPO (World Intellectual Property Organization), EPO (European Patent Office) and United Kingdom. Its main competitors in its focus markets micro-structure and nano-technology, audio-visual technology and semiconductors are SHANGHAI LANPEI NEW MATERIAL TECHNOLOGY CO LTD, HONGQISHENG PREC ELECTRONIC QINHUANGDAO CO LTD and KONDO HITOSHI.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 7 | |
#2 | EPO (European Patent Office) | 2 | |
#3 | United Kingdom | 2 | |
#4 | United States | 2 | |
#5 | Australia | 1 | |
#6 | Canada | 1 | |
#7 | China | 1 | |
#8 | Israel | 1 | |
#9 | Republic of Korea | 1 | |
#10 | Singapore | 1 | |
#11 | Taiwan | 1 |
# | Name | Total Patents |
---|---|---|
#1 | Granek Filip | 18 |
#2 | Rozynek Zbigniew | 10 |
#3 | Wiatrowska Aneta | 5 |
#4 | Kowalczewski Piotr | 4 |
#5 | Gos Tomasz | 2 |
#6 | Dusza Michal | 2 |
#7 | Zieba Maciej | 1 |
#8 | Zając Mateusz | 1 |
#9 | Piotr Kowalczewski | 1 |
#10 | Aneta Wiatrowska | 1 |
Publication | Filing date | Title |
---|---|---|
US2021087420A1 | Metallic nanoparticle compositions | |
WO2021019435A1 | Methods of dispensing a metallic nanoparticle composition from a nozzle onto a substrate | |
WO2021001763A1 | Method of forming contiguous conductive features on a substrate | |
WO2020212840A1 | Methods of detecting and adjusting contact of a micro-structural fluid ejector to a substrate and method of detecting a fault condition in fluid flow from a micro structural fluid ejector onto a substrate | |
WO2020157547A1 | Fluid printing apparatus | |
GB201812691D0 | Method of forming a structure upon a substrate | |
GB201809311D0 | Method for removing bottlenecks | |
CN109478558A | For forming the method from bottom to top of cable architecture on substrate |