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INT SEMICONDUCTOR TECH LTD

Overview
  • Total Patents
    46
About

INT SEMICONDUCTOR TECH LTD has a total of 46 patent applications. Its first patent ever was published in 2004. It filed its patents most often in Taiwan and China. Its main competitors in its focus markets semiconductors are GUANGDONG ZHINENG TECH CO LTD, KOKUREN KODEN KAGI KOFUN YUGEN and FUJIAN CPT DISPLAY TECHNOLOGY.

Patent filings in countries

World map showing INT SEMICONDUCTOR TECH LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 42
#2 China 4

Patent filings per year

Chart showing INT SEMICONDUCTOR TECH LTDs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Chen Yeh-Shun 10
#2 Kuo Hou-Chang 8
#3 Wu Chen-Ming 5
#4 Lo Yuan-Hung 4
#5 Ho Chih-Wen 4
#6 Yang Chi-Hui 4
#7 Chang Tien-Kuo 3
#8 Yeh Cheng-Ho 3
#9 Chan Chi-Ming 3
#10 Zhihui Yang 3

Latest patents

Publication Filing date Title
TW201116811A Temperature sensing tape with RFID tag
TW201044527A Chip architecture having film-faced metal bumps and semiconductor flip-chip device applied from the same
TW201019440A Bumped chip and semiconductor flip-chip device applied from the same
TW201003528A RFID bidirectional transmission system
TW200949709A Paster with RFID tag
CN101527006A Radio frequency label capable of selecting antenna lapping direction and circuit card body thereof
TW200937301A RFID tag with an antenna capable of selecting lap joint direction and circuit card thereof
TW200933488A A RFID tag with light-emitting diode
CN101482936A Production method and structure for RFID system label with face bonding element
TW200832578A Method for forming Au-bump with clean surface
TW200916879A Bonding method for chip on glass
CN101382994A Touching and sliding type packaging structure for thin type finger print identifier
CN101378046A Structure, method and substrate for packaging touch-slide type thin type fingerprint identifier
TW200841108A Compact camera module
TW200839895A Method for flip-chip bonding with non-conductive paste
TW200828459A Method of packaging micro sensor
TW200819838A A display device with overheat protection for a electrical unit
TW200816334A Gold bumping process
TW200816410A Chip module for chip card and the metal film carrier
TW200816276A Manufacturing process for reducing residual stress of UBM