WO2021017744A1
|
|
Packaging process for multi-chip module
|
CN111510085A
|
|
Output circuit of power amplifier
|
CN111510077A
|
|
Broadband Doherty amplifier
|
CN111510074A
|
|
Radio frequency power amplifier with high video bandwidth
|
CN111490034A
|
|
Multi-chip module with high isolation
|
CN109150114A
|
|
A kind of efficient power amplifier of high integration
|
CN108933572A
|
|
A kind of radio-frequency power amplifier multi-chip module
|
CN110417357A
|
|
A kind of integrated Doherty amplifier of compact
|
CN110417356A
|
|
A kind of broadband high-efficiency Doherty amplifier
|
CN110417355A
|
|
A kind of integrated high resistant line Doherty amplifier
|
CN110416204A
|
|
Semiconductor devices with passivation layer
|
CN107547054A
|
|
Mesh power amplifier in separate type compensation inductance
|
CN107332518A
|
|
A kind of broadband Doherty power amplifier
|
US2017055341A1
|
|
Unpacked structure for power device of radio frequency power amplification module and assembly method therefor
|
CN107919351A
|
|
A kind of radio frequency power amplification modules and its assemble method
|
CN103390593A
|
|
Semiconductor substrate and manufacturing method thereof
|
CN103346096A
|
|
Packaging technology for RF device
|
CN103237412A
|
|
Electrical part mounting structure, manufacture method of electrical part mounting structure, and electrical part product
|
CN102969986A
|
|
Output circuit structure of radio frequency power amplifier
|
CN102956605A
|
|
Semiconductor component and manufacturing method thereof
|