| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 9 | |
| #2 | United States | 7 | |
| #3 | China | 3 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Optics | |
| #3 | Computer technology | |
| #4 | Micro-structure and nano-technology | |
| #5 | Transport | |
| #6 | Digital networks | |
| #7 | Mechanical elements |
| # | Name | Total Patents |
|---|---|---|
| #1 | Pamler Werner | 1 |
| #2 | Pandey Pramod | 1 |
| #3 | Pufall Reinhard | 1 |
| #4 | Narayan Chandrasekhar | 1 |
| #5 | Thiele Jorg | 1 |
| #6 | Alvarez David | 1 |
| #7 | Jorg Thiele | 1 |
| #8 | Domanski Krzysztof | 1 |
| #9 | Moukara Molela | 1 |
| #10 | Fernandez Elstan Anthony | 1 |
| Publication | Filing date | Title |
|---|---|---|
| WO2007050038A1 | Method of manufacture of encapsulated package | |
| US7126186B2 | Compensation component and process for producing the component |