| # | Country | Total Patents | |
|---|---|---|---|
| #1 | EPO (European Patent Office) | 4 | |
| #2 | United States | 3 | |
| #3 | Japan | 2 | |
| #4 | Taiwan | 2 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Electrical machinery and energy |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Semiconductor light sources |
| # | Name | Total Patents |
|---|---|---|
| #1 | Sun Wei-Kuo | 5 |
| #2 | Sun Tseng-Bao | 3 |
| #3 | Lee Ko-Shin | 2 |
| #4 | Chen Pi-Hsiang | 1 |
| #5 | Sun Zeng-Boa | 1 |
| #6 | Li Ke-Sin | 1 |
| #7 | Lee Ko-Hsin | 1 |
| #8 | Hsu Chi-Yuan | 1 |
| Publication | Filing date | Title |
|---|---|---|
| EP2031657A1 | Package structure for a high-luminance light source | |
| EP2017897A1 | Package structure for a high-luminance light source | |
| US2007096136A1 | Cladding layer structure of a LED package structure | |
| EP1850383A1 | Three wavelength light emitting diode | |
| EP1850399A1 | Sealing structure for a white light emitting diode | |
| TW200721526A | LED structure with three wavelength | |
| TW200717857A | Packaging structure for a white light LED |