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IBIDEN CO LTD

Overview
  • Total Patents
    12,562
  • GoodIP Patent Rank
    760
  • Filing trend
    ⇧ 16.0%
About

IBIDEN CO LTD has a total of 12,562 patent applications. It increased the IP activity by 16.0%. Its first patent ever was published in 1981. It filed its patents most often in Japan, United States and EPO (European Patent Office). Its main competitors in its focus markets audio-visual technology, machines and semiconductors are SCHULZ HARDER JUERGEN, SAMSUNG ELECTRIC MACHINES CO L and KLUGE CLAUS PETER.

Patent filings per year

Chart showing IBIDEN CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Asai Motoo 586
#2 Ito Yasutaka 581
#3 Hiramatsu Yasuji 501
#4 Ohno Kazushige 487
#5 Tsukada Kiyotaka 404
#6 Kunieda Masafumi 351
#7 Kariya Takashi 348
#8 Ido Takahiko 214
#9 Takahashi Michimasa 203
#10 Shimada Kenichi 196

Latest patents

Publication Filing date Title
JP2021006588A Antimicrobial member
JP2021006589A Antimicrobial member
JP2021004902A Method for measuring amount of copper adhesion on surface of member
WO2021070933A1 Heat insulation sheet for battery packs, and battery pack
US2021092841A1 Printed wiring board and method for manufacturing the same
JP2020203943A Growth promoter of strawberry fruit, and flower bud formation promoter of strawberry
WO2021054110A1 Heat insulation sheet for battery pack, and battery pack
US2021068264A1 Method for manufacturing printed wiring board
US2021068265A1 Printed wiring board and method for manufacturing the same
US2021066982A1 Motor coil substrate and motor
WO2021039844A1 Heat insulation sheet for assembled batteries and assembled battery
WO2021044875A1 Method for producing honeycomb filter
WO2021049274A1 Mat material, exhaust gas purification device, mat material-equipped exhaust tube, and exhaust system
WO2021044874A1 Honeycomb filter and method for manufacturing honeycomb filter
US2021045238A1 Wiring substrate
US2021037660A1 Printed wiring board and method for manufacturing printed wiring board
US2021028342A1 Printed wiring board
US2021028340A1 Printed wiring board
WO2021039200A1 Thermally conductive resin and heat dissipation structure
KR20210011884A Carbon composite material