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SCHULZ HARDER JUERGEN

Overview
  • Total Patents
    33
About

SCHULZ HARDER JUERGEN has a total of 33 patent applications. Its first patent ever was published in 1986. It filed its patents most often in Germany, EPO (European Patent Office) and Japan. Its main competitors in its focus markets semiconductors, machines and audio-visual technology are HIGH CONDUCTION SCIENT CO LTD, IBIDEN CO LTD and ENDICOTT INTERCONNECT TECH INC.

Patent filings in countries

World map showing SCHULZ HARDER JUERGENs patent filings in countries
# Country Total Patents
#1 Germany 23
#2 EPO (European Patent Office) 6
#3 Japan 3
#4 United States 1

Patent filings per year

Chart showing SCHULZ HARDER JUERGENs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Schulz-Harder Juergen Dr Ing 16
#2 Schulz-Harder Juergen 8
#3 Schulz-Harder Juergen Dr-Ing 5
#4 Maier Peter H 3
#5 Schulz Harder Juergen 3
#6 Maier Peter 3
#7 Edwards Steve 2
#8 Akyuerek Altan Dipl Ing 1
#9 Schulz-Harder Dr-Ing Juergen 1

Latest patents

Publication Filing date Title
EP1063873A2 Process for manufacturing substrates with patterned metallizations and holding and fixing element used in the process
DE19930207A1 Process for the production of substrates with structured metallizations and holding and fixing element for use in this process
DE19925510A1 Heat sink device for electrical or electronic component, circuit or module
DE19853750A1 Heat sink device for electrical or electronic component, circuit or module
DE19827414A1 Method of manufacturing a metal-ceramic substrate
DE19815817A1 Cooling system
DE19727628A1 Package or casing for electronic power component
DE19758452A1 Method of manufacturing a metal-ceramic substrate and metal-ceramic substrate
DE19708363C1 Method of manufacturing a metal-ceramic substrate and metal-ceramic substrate
DE19527867A1 Metal substrate for electrical and/or electronic semiconductor circuit - has Peltier chip connected between respective overlapping metallisation structures of upper and lower ceramic layer
DE4444680A1 Multilayer substrate esp. for power semiconductor component
DE4444681A1 Ceramic substrate and process for its manufacture
DE4338706A1 Multilayer substrate
DE4328353A1 Multi-layer substrate
DE4319944A1 Multiple substrate and process for its manufacture
DE4319848A1 Method of manufacturing a metal-ceramic substrate
DE4318463A1 Method of manufacturing a metal-ceramic substrate
DE4318241A1 Metal coated substrate with improved resistance to thermal shock
DE4318061A1 Method of manufacturing a metal-ceramic substrate
DE4208604A1 Ceramic connector material for electric circuit substrate - has copper layer with coating of aluminium oxide ceramic layer and aluminium nitride ceramic layer