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HUTEM CO LTD

Overview
  • Total Patents
    20
  • GoodIP Patent Rank
    169,426
About

HUTEM CO LTD has a total of 20 patent applications. Its first patent ever was published in 2007. It filed its patents most often in Republic of Korea. Its main competitors in its focus markets semiconductors, medical technology and materials and metallurgy are CHANG SHU-MING, PANG QIQI and JOU JWO-HUEI.

Patent filings in countries

World map showing HUTEM CO LTDs patent filings in countries
# Country Total Patents
#1 Republic of Korea 20

Patent filings per year

Chart showing HUTEM CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Shin Hong Soo 18
#2 Do Hyun Jung 15
#3 Kim Jin Won 6
#4 Choi Yun Seong 5
#5 Shin Hong Su 2
#6 Im Ki Ju 2
#7 Han Jae Hyuk 2
#8 Kim Sang Sig 1
#9 Kim Jong Hoon 1
#10 Nam Jung Hyuk 1

Latest patents

Publication Filing date Title
KR20210002991A Substrates bonding apparatus
KR20190143231A Micro led transfer method and display device thereof
KR20190139596A Medicinal fluid tank for medicine manufacture and method discharging medicine
KR20180015935A Vial and manufacturing method and device thereof
KR20180001890A Silicon substrate direct bonding method and apparatus system thereof, silicon substrate direct bonding apparatus align parts verification method
KR20170108684A Substrate pre-bdoning apparatus, substrate bonding apparatus and substrate bonding method using thereof
KR101624635B1 Apparatus for manufacturing replica stamp and method for manufacturing replica stamp
KR20160108667A Prefilled syringe filling apparatus having vaccumizing block and prefilled syringe filling mehtod using vaccumizing block
KR101521971B1 Wafer bonder, wafer bonding appratus, and wafer bonding metheod using plasma activation process
KR20150001930A Wafer bonder having holder and wafer bonding method
KR20130129114A Imprint apparatus unsing fluid pressure, imprint method using thereof and substrates bonding apparatus, substrates bonding method
KR101320064B1 Wafer bonder using dual-cooling and wafer bonding method
KR20120114185A Wafer bonder unsing electromagnetic wave heating
KR20130017726A Prefilled syringe filling machine having vaccumizing part
KR20110025550A Apparatus for correcting position of wafer, wafer bonder and jig for wafer bonder
KR100933985B1 Wafer bonder and imprint apparatus
KR100917916B1 Prefilled syringe filling machine and prefilled syringe filling method
KR20090056510A Ir cut-off glass and method for manufacturing the same
KR100861787B1 Transparent sheet heater and method for manufacturing the same